High-Melting-Point Toughened PA66

Core performance

As a professional manufacturer, ACCOM offers High-Melting-Point Toughened PA66, which achieves a melting point of up to 265-275°C (10°C higher than standard PA66) and a heat deflection temperature of 240-255°C (150% higher than ordinary toughened PA66) through a duplex polymer architecture (highly crystalline PA66 matrix nanoscale elastomer dispersion) and composite nucleation technology (organic-inorganic hybrid nucleating agent increases the crystallization rate by 40%).

The core breakthrough is to break the traditional limitation of "heat resistance must be brittle": it still maintains a notched impact strength of 25-35kJ/m² (5 times that of standard PA66) at a high temperature of 200°C, a tensile strength of 80-100MPa (balancing toughness and rigidity), and a very low coefficient of thermal expansion (2.5-3.0×10⁻⁵/°C) to resist thermal cycling deformation.

Application scenarios

1. Power battery module bracket: 0.8mm wall thickness design has passed CTI>600V withstand voltage certification, UL94 V-0 flame retardant rating to resist thermal runaway;

2. Motor end cover assembly: synchronously resolve 230°C electromagnetic loss heat 2000rpm vibration load, replace the metal-thermal insulation pad composite structure;

3. Industrial robot joint housing: 100,000 impact cycles at 190°C continuous operating temperature (ISO 8308 standard);

4. Sintering line conveying parts: withstand 210°C metal dust environment, wear rate < 3mg/1000h (better than PEEK) 5G RF shielding cover: 2.8GPa bending modulus to suppress millimeter wave resonance deformation, dielectric constant stable at 3.2 (1-40GHz);

5. Ultra-thin heat dissipation architecture: 1.2mm thin and light components carry 80W TDP thermal power consumption, and the thermal conductivity is increased to 0.45W/m·K.

Accom's High-Melting-Point Toughened PA66 replaces metal die castings in the field of new energy, simplifying the assembly level of battery packs by 30%; Break the PEEK monopoly in high-end manufacturing and reduce the cost of turbine pipelines by 40%; We provide 0.5mm ultra-thin and heat-resistant solutions for electronic miniaturization, and promote the evolution of thin devices.